蒐索(suo)
| 序號 | 測試項目 | 樣品數/批 | 批數 | 測試方(fang)灋 |
| 1 | Pre- and Post- Stress Electrical Test | 所有提交認證的産品 | 用戶槼範 | |
| 3 | High Temperature Exposure (Storage) | 77 Note B | 1 | MIL-STD- 202 Method 108 |
| 4 | Temperature Cycling | 77 Note B | 1 | JESD22 Method JA-104 |
| 5 | Destructive Physical Analysis | 10 Note B | 1 | EIA-469 |
| 6 | Moisture Resistance | 77 Note B | 1 | MIL-STD- 202 Method 106 |
| 7 | Biased Humidity | 77 Note B | 1 | MIL-STD- 202 Method 103 |
| 8 | Operational Life | 77 Note B | 1 | MIL-STD-202 Method 108、MIL-PRF- 27 |
| 9 | External Visual | 所有提交認證的産品 | MIL-STD- 883 Method 2009 | |
| 10 | Physical Dimension | 30 | 1 | JESD22 Method JB-100 |
| 11 | Terminal Strength (Leaded) | 30 | 1 | MIL-STD- 202 Method 211 |
| 12 | Resistance to Solvents | 5 | 1 | MIL-STD-202 Method 215 |
| 13 | Mechanical Shock | 30 Note B | 1 | MIL-STD- 202 Method 213 |
| 14 | Vibration | 30 Note B | 1 | MIL-STD-202 Method 204 |
| 15 | Resistance to Soldering Heat | 30 | 1 | MIL-STD-202 Method 210 |
| 16 | Thermal Shock | 30 | 1 | MIL-STD-202 Method 107 |
| 17 | ESD | 15 | 1 | AEC-Q200-002 or ISO/DIS 10605 |
| 18 | Solderability | 15 each condition | 1 | J-STD-002 |
| 19 | Electrical Characterization | 30 Note A | 3 | 用戶槼範 |
| 20 | Flammability | / | / | UL-94 |
| 21 | Board Flex | 30 | 1 | AEC-Q200-005 |
| 22 | Terminal Strength (SMD) | 30 | 1 | AEC-Q200- 006 |
| 23 | Beam Load Test | 30 | 1 | AEC-Q200- 003 |
| 24 | Flame Retardance | 30 | 1 | AEC-Q200-001 |
| 25 | Rotation Life | 30 | 1 | MIL-STD-202 Method 206 |
| 27 | Surge Voltage | 30 | 1 | JIS-C-5101- 1 |
| 29 | Salt Spray | 30 | 1 | MIL-STD-202 Method 101 |
| 30 | Electrical Transient Conduction | 30 | 1 | ISO-7637-1 |
| 31 | Shear Strength | 30 | 1 | AEC-Q200-004 |
| 32 | Short Circuit Fault Current Durability | 30 | 1 | AEC-Q200-004 |
| 33 | Fault Current Durability | 30 | 1 | AEC-Q200-004 |
| 34 | End-of-life Mode verification | 30 | 1 | AEC-Q200-004 |
| 35 | Jump Start Endurance | 30 | 1 | AEC-Q200-004 |
| 36 | Load Dump Endurance | 30 | 1 | AEC-Q200-004 |
